Temperature Difference Sensor to Monitor the Temperature Difference in Processor Active Heat Sink Based on Thermopile

The monitoring of processor temperature is crucial to increase its efficiency. One the novel approaches use information not only about CPU (Central Processing Unit) thermal state, but also changing environmental conditions. additional difference sensor monitor changes in environment necessary. dedicated for active heat sink, often used inside laptops, was designed, fabricated and investigated. To fulfill requirements match specific shape hybrid proposed. It composed six thermocouples using thick-film LTCC (Low Temperature Cofired Ceramic) technology combined with wire thermocouples. Thick-film/LTCC flat substrates thermoelectric paths ensured good contact between monitored surface. wires allowed adjusting complicated heatsink. Three different versions were realized compared. All them seem be suitable measuring given application they can further works.